Boards/Backplanes

Needles enable the manufacture of PCBs for IoT applications

10th March 2015
Siobhan O'Gorman
0

For bed of nails testing of high density, micro-scale PCBs, ESCATEC has invested in ultra-small needles.This will enable the company to provide customers with next-gen, high density, micro-scale PCBs that are growing in popularity, especially for wearable electronics and IoT applications. Automated bed of nails testing ensures that production costs are kept low for customers and that yields are improved as manual testing with probes is eliminated.

"PCBs are always getting smaller and more densely packed," said Thomas Eschenmoser, Section Head Test Engineering, ESCATEC. "This creates a challenge for the testing phase of a PCB as the landing pads for test needles become smaller as does the tolerance for the placement of the probe needles. We recently added needles that are only 0.5mm in diameter to our test capabilities as part of our on-going programme of investing in the latest technologies for high density PCB manufacture."

This is also part of ESCATEC's drive to automate as much of the test procedures as possible. "Every step that involves a human being has a cost element," added Eschenmoser, "so we are refining all our test procedures to either remove the human element or simplify it. For example, a test can be automated such that it becomes a simple red light for fail or green light for pass making the possibility for human error much less. Similarly, bar codes are used throughout the manufacturing process so that these are just scanned and there is no possibility of an transcription error."

Martin Kingdon, Business Development Director, ESCATEC, commented: "By virtually eliminating the human cost element, we can be competitive with contract manufacturers based in low wage countries plus we have the added benefits of Swiss standards of quality. Our central European location means that we are close the customers and their market so that the costs and delays of transport from China are eliminated."

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