COM Express board features AMD Embedded SoC
A COM Express board, designed to withstand challenging conditions, has been released by Hectronic. Based on the second generation AMD Embedded G-Series SOC, the H6066 features a type 6 COM Express pinout. The board, which measures 95x95mm, features a wide input voltage and is powered by a -4.75 to +20V input.
The board has a rich set of I/O interfaces including four PCI Express ports, two USB 3.0, eight USB 2.0 and three SATA ports. As well as this, dual independent displays can be connected to dual 24-bit LVDS and one of the digital display interfaces DVl, HDMI, DisplayPort or VGA. Along with an onboard soldered BGA SATA Flash SSD of up to 32GB, the board supports up to 4GB onboard soldered DDRIII DRAM. Customers are also provided with the option of soldered FLASH SSD storage and conformal coating.
There are two versions of H6066: the GX-411GA processor and the GX-420CA processor. The former is a 15W processor is specified for an operating temperature range from -40 to +85°C, while the latter is 25W and specified for 0 to +60°C. A BIOS based on the Phoenix SecureCore UEFI BIOS has been developed for the board by Hectronic. Support packages for XP Embedded, Windows Embedded Standard 7, Windows Embedded 8 and Linux are also provided by the company. Suitable applications for the board include those within defence, transportation, maritime, medical and industrial automation.
”The combination of powerful quad-core processors, excellent graphics and the possibility to develop rugged systems for harsh environments are the reasons why H6066 will be interesting to use in many applications,” says Robert Helenius, Product Manager, Hectronic.