Alphawave semi showcases chiplet innovations at ai hardware & edge ai summit 2024

Highlighting Breakthroughs in AI and Connectivity

Reflecting on his upcoming presentation, Dr. Chan Carusone remarked, “I look forward to presenting at this prestigious event, especially given the recent breakthroughs in optical interconnects that have enabled AI systems to continue their significant pace of improvement. The push for custom AI hardware is rapidly evolving, and I will examine how chiplets deliver the flexibility required to create energy-efficient systems-in-package designs that balance cost, power, and performance.”

Exclusive Demos of Advanced Connectivity Solutions

Visitors to Alphawave Semi’s Booth #9 will have the opportunity to see the advanced HBM3 Sub-System designed specifically for AI workloads, featuring a live demonstration of the HBM3e IO loopback eye diagram operating at 9.6 Gbps on 3nm silicon. Alphawave will also showcase the AresCORE, the industry's first 3nm 24Gbps UCI integrated with TSMC CoWoS® Advanced Packaging, with a live demonstration of D2D traffic at 24 Gbps per lane.

At Samtec’s vendor booth #41, attendees can experience the PipeCORE – AW 128G PAM4 Gen7 solution, integrated with Samtec's 128G PAM4 NovaRay technology. This setup will feature a demonstration of transmission at 128 GT/s using Samtec’s board, showcasing performance that exceeds a 30 dB channel.

Join the Summit

The AI Hardware & Edge AI Summit 2024 will be held at the San Jose Signia by Hilton Hotel, with Dr. Chan Carusone’s presentation scheduled for September 11 at 3:25 p.m. PDT. Attendees will gain insights into the evolving landscape of chiplet interconnects and their impact on next-generation technologies.

For more information on attending the summit, visit AI Hardware & Edge AI Summit. To learn more about Alphawave Semi, visit Alphawave Semi.