Dow launches interactive platform to connect end-to-end silicone solutions for 5G networks

The interactive platform is a powerful tool to connect current and potential customers to the Dow 5G Ecosystem – Dow’s growing portfolio of solutions to help enable smart connectivity and the future of communications.

5G, or 5^th gen technology, is an exciting evolution in telecommunications, enabling unprecedented levels of intelligent connectivity with significant improvements in the quality of service, time delay, throughput speed, energy efficiency and system performance.

With product innovations and proven materials, the Dow 5G Ecosystem helps to advance this technology with Dow’s robust portfolio of product options in thermal management, electromagnetic interference (EMI) shielding, adhesion, sealing and encapsulation, and component moulding.

Dow’s silicone solutions help advance both innovation and sustainability goals by offering materials with thermal protective properties, low volatile emissions, solvent-free formulations, and room-temperature curing to conserve energy.

“5g.dow.com is one of many such tools being implemented across Dow globally to help provide a more customised, step-by-step journey for our customers and make it easier for them to find the most relevant information on Dow.com,” said Cathy Chu, Strategic Marketing Director, Dow Consumer Solutions. “This platform can play a significant role in enabling next-generation technologies and the future of faster, smarter, simpler connectivity. We are excited to now make this incredible resource available.”

The future of connectivity starts at 5G Dow

Visitors entering 5G.dow.com will begin at the ‘splash page,’ which includes a brief introduction and invitation to get started on the 5G Ecosystem landing page, where they can explore by broad application area or click on specific sub applications. Throughout, ‘exploded’ 3D video views show where Dow’s silicone technology can be found in various technologies, such as: 5G-enabled consumer devices and technologies (smartphones, PCs, wearable devices, and advanced driver assistance systems (ADAS), telecommunications infrastructure (base stations, optical communications, core networks), and cloud computing and data centres (servers, high-performance computing chips, and other datacom devices and equipment).

End-to-end product solutions for the 5G Ecosystem

“Dow offers one of the world’s broadest and most robust portfolios of silicones and silicone-based solutions for the 5G Ecosystem,” said Chang Lee, Global R&D Director, Dow Consumer Solutions. “Silicones are truly remarkable, high-performance materials, with properties that can be fine-tuned to meet specific customer requirements. They can also help manufacturers speed production, reduce energy consumption, and promote sustainability. With 5G.dow.com, we’re making our silicone and silicone-based solutions more accessible than ever to those seeking them for their applications.”

Thermal management

For thermal management of 5G-enabled smart devices, 5G base stations, cloud computing and datacentres, Dow supplies thermally conductive silicone greases, gels, adhesives and encapsulants that draw damaging heat away from electronic components.

EMI shielding

To protect sensitive electronics from electromagnetic interference that can lead to malfunctions, data loss or even failure, Dow supplies electrically conductive silicone adhesives, elastomers, coatings, emulsions, and formed-in-place gaskets (FIPG) that conduct electricity while blocking EMI.

Adhesion, sealing and encapsulation

Dow’s silicone adhesives, sealants, conformal coatings and encapsulants enable delicate electronic components to perform consistently, even under harsh environmental conditions. In electronics assembly, these materials deliver flexible protection against environmental contamination, vibration, and thermal stress. In electronics processing, special protective tape with silicone adhesive delivers super wetting performance on rough surfaces and good bonding performance on low-surface-energy materials.

Component moulding

In component moulding, Dow’s LSR materials provide a range of performance properties, aesthetics and processing options. Dow’s portfolio includes non-post-cure LSRs, self-lubricating LSRs, fluoro LSRs and optically clear LSRs. The outstanding flow properties and wide range of durometers of Dow’s LSRs enable components to be produced with tight dimensions, thick and thin details, and consistencies from soft to firm. SILASTIC MS series Mouldable Silicones offer high luminous transmittance, low haze and scatter, and heat and UV resistance than optical-grade plastics for light guide applications in smart devices.