ASMPT unveil one of its most advanced die bonding systems

Johann Weinhaendler, General Manager at ASMPT AMICRA in Regensburg, Germany, emphasises the importance of precision in manufacturing technologies, especially for fast data transmission and accurate sensor technology. He notes the growing demand in sectors such as optoelectronics and advanced packaging, with a particular surge in silicon photonics. The NOVA Pro, he explains, is capable of producing components for 400/800 Gigabit/sec networks and co-packaged optics, meeting the increasing needs of the industry.

Characterised by its flexibility and speed, the NOVA Pro boasts die placement for sizes ranging from 0.1 to 25 millimetres. It achieves a maximum accuracy of ±1 micron @ 3σ with speeds up to 1,000 units per hour (UPH), and at ±3.0 microns @ 3σ, it can reach up to 3,500 UPH. This performance level is maintained even in flip-chip mode.

The machine's exceptional placement accuracy is achieved through a unique dynamic alignment method combined with laser-based substrate heating technology. Its Active Bond Force Control allows for precise dosing of bonding forces, ranging from 10 g to 5,000 g. Dies can be affixed using an epoxy resin stamp with volumetric dosing and UV-cured adhesives. The precision die fastening methods include in-situ bonding and eutectic die bonding using a bonding tool (up to 350 °C), a ceramic pulse heater (up to 500 °C), or a contactless laser (up to 450 °C). An integrated post-bond inspection guarantees top-notch quality. The NOVA Pro also features a substantial substrate area of 550 × 600 mm, catering to the advanced packaging applications market.

Johann Weinhaendler asserts that choosing the NOVA Pro means benefiting from the extensive experience of a market leader committed to achieving zero defects per million opportunities (DPMO). He highlights the machine's high precision and performance reserves, along with its versatile fixation and bonding options, making it a sound investment for the future.