At this year’s PCIM trade event in Nuremberg, ASMPT focuses on power electronics for the vehicle of the future at booth 145 in hall 6.

The rapid development of artificial intelligence (AI) is driving the demand for high-performance processors and placing great demands on electronics manufacturing. ASMPT is meeting these challenges with innovative placement technology that is capable of processing both super-miniaturised components and large, heavy AI chips with exceptional precision.

ASMPT will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at its booth during the OFC 2025 trade show, from 1-3 April in California.

Dr. Thomas Marktscheffel, Director Product Management Software Solutions at ASMPT, was honoured by the IPC at this year's IPC APEX EXPO in Anaheim, California, for his many years of commitment to the organisation.

ASMPT has a new stationary camera available for its placement machines equipped with SIPLACE placement heads CPP and TWIN.

ASMPT presents Vortex II: a high-performance die bonder for the production of mini LED displays, including those used in the automotive industry.

ASMPT has implemented another step in automating product changeovers on the SMT line.

ASMPT is presenting the the multi-purposes precision pick & place solution NUCLEUS XLplus.

The WORKS Software Suite from ASMPT raises production planning in electronics manufacturing to a new level. With its seamless integration of ERP systems and continuous data feedback loop, the software optimises the planning process in real time – from receiving an order to starting its production run.

ASMPT has presented its SilverSAM machine for makers of modern power electronics.

The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical and electronic components are integrated in a common housing.

electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.

ASMPT, the global provider of hardware and software for semiconductor and electronics production, presents the ALSI LASER1205, a multi-beam laser dicing platform that sets new standards in terms of precision and performance.

ASMPT will participate in the upcoming European Conference on Optical Communication (ECOC) 2024, taking place from 23–25 September 2024 in Frankfurt, Germany.

ASMPT has been awarded the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second consecutive year. 

ASMPT has presented its die and module bonding platform that can be used in a variety of ways for producing power modules.

ASMPT and IBM have announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.

ASMPT has added two new features to its DEK printing platforms that automate solder paste transfers and simplify squeegee changes.

At the PCIM Europe event in Nuremberg, ASMPT showcased a comprehensive power module manufacturing solution. 

With its new SIPLACE CA2 hybrid placement solution ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs (system-in-package modules) directly into the SMT line.