Application Notes
0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. B)
Texas Instruments
Published : 01 Dec 15
Description
This document provides board mount application guidelines for Pb-free flip chip BGA packages with a 0.65 millimeter pitch including device handling and management PCB design guidelines PCB assembly parameters rework processes and troubleshooting.
Featured products
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | DP83TC811-Q1 |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | UCC15240-Q1 |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | TMP1827 |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | SN74AHC1G02-Q1 |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | DLP301S |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | TMUXHS221LV |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
