SEMITOP® 4 power modules offer high power and high reliability

Hertford, UK, 15 September 2006 – SEMIKRON has introduced SEMITOP® 4, the most powerful member of its SEMITOP family of isolated power modules. These modules are designed for PCB soldering and use baseplate-free technology to guarantee high reliability and isolation with the lowest overall thermal resistance. Mounting is simple and fast, using single-bolt fixing to the heat sink, followed by soldering to the PCB.

The new modules are available in three-phase IGBT and converter inverter brake (CIB) configurations with currents up to 200A with 600V silicon and up to 100A with 1200V silicon. The SEMITOP® 4 will also be offered with the new Trench4 IGBT chip technology.

The new range serves applications such as drives and power supplies up to 40kVA. The pin layout and outline dimensions offer easy PCB routing and an extremely compact design. The modules measure only 60mm (W) x 55mm (L) x 12mm (H).

To assure a robust, highly reliable product, the SEMITOP® 4 modules have been designed using very detailed mechanical and thermal finite element analysis software as part of the process. To verify the theoretical analysis, numerous different qualification and reliability tests were performed for over 10,000 hours.