Power for e-mobility

At PCIM Europe 2023, which will be held 9—11 May 2023 in Nuremberg, the market specialist in semiconductor manufacturing equipment will present two machines for separation and sintering.

The Semiconductor Solutions segment of ASMPT will be present with its own booth at the international trade fair for power electronics, intelligent drive technologies, renewable energies, and energy management. The market specialist in semiconductor manufacturing and processing technology will focus especially on power supply technology in the automotive sector.

Two machines will demonstrate what innovative manufacturing technology can accomplish today:

• The LASER1205 UVP semiconductor separation platform operates with an accuracy rating of less than 1.5µm, a heat-affected zone of less than 2µm, and a gap width of less than 12µm. This laser dicing technology can support the technology roadmap of the power semiconductor market.
• The silver sintering machines of the SilverSAM series process substrates measuring up to 355 × 293mm in an oxidation-free and copper-friendly environment supporting die, clip, double-sided-cooled, and heatsink sintering processes. They are particularly suited for power module production where sintering is the best and most reliable bonding technology for high-volume manufacturing.

Power for ADAS, connectivity, and the drivetrain

“The car of the future requires a lot of electrical energy for entertainment/infotainment, connectivity, advanced driver assistance systems (ADAS) and, of course, the drivetrain,” explains David Felicetti, Business Development & Product Marketing Manager at ASMPT. “This requires power distribution systems than cope as well with the high-power density as with the frequently rough environmental conditions, and that can be manufactured at a competitive price.

“When automotive manufacturers talk with ASMPT, they have come to the right address. ASMPT is the only supplier that seamlessly covers the power module production process with its machines – from the wafer to the finished sintered module. At the ASMPT booth, visitors can see what this looks like in practice and discuss each step with specialist staff. How do you achieve more yield and lower TCO when dicing SiC wafers? How exactly does the production of power modules progress from the laboratory to mass production? Experts and exhibits provide answers to these and many other questions.