Platforms address emerging IGBT requirements

High-voltage IGBTs are particularly suitable for electrical switching of industrial and traction drives, wind and solar energy systems and long-distance electrical transmission. Chip technology developments allow IGBTs to meet demands for higher energy efficiency and higher operating temperature, as well as miniaturisation, reliability and cost reduction. Traditionally, these developments have allowed IGBTs to meet these demands with little modification to the standard packaging technology. However, environments are becoming more demanding, therefore, packaging needs to be modified. 

Infineon’s power module platforms address emerging system requirements for high-power density, energy efficiency, long lifecycle and robustness. Providing a simplified structure for the DC link terminal and capacitor, the platforms enable the connection of similar parts in parallel. The AC terminals can be connected in parallel with only one busbar. The platforms are both flexible and scalable, simplifying system design and speeding time-to-market.

“Taking into account the increasing challenges IGBT technology is facing, we are very pleased to present a package that answers the needs of our industry both for today and for the foreseeable future. We are most certain that the new module package will be of great benefit for all demanding high-power applications,” said Markus Hermwille, Director High Power Segment of the Industrial Power Control Division, Infineon Technologies. “It is our aim to secure a broad and reliable base for the supply of the new high-power platform, which is why we are inviting the industry to make use of the design.”

Infineon is offering a royalty-free license of its design to all providers of IGBT power modules, making the power module platforms widely available. The company will also be exhibiting the platforms at PCIM 2015, which takes place from 19^th to 21^st May in Nuremberg, Germany.