New SSO10T TSC top-side cooling package for power MOSFETs

This package is designed with a direct top-side cooling concept, providing quality thermal performance by preventing heat transfer into or through the PCB of automotive electronic control units. It facilitates a straightforward and compact design for double-sided PCBs, significantly reducing the need for cooling and system costs in future automotive power applications. Consequently, the SSO10T TSC is ideally suited for a wide range of applications, including electric power steering (EPS), EMB, power distribution, brushless DC drives (BLDC), safety switches, reverse battery protection, and DCDC converters.

The SSO10T TSC has a footprint of 5 x 7mm², expanding on the robust housing of the established industry standard SSO8, which measures 5 x 6mm². Its top-side cooling feature allows for an increase in performance by over 20% and up to 50%, dependent on the thermal interface material (TIM) used and the thickness of the TIM. This package is also JEDEC listed for open market transactions, ensuring broad second source compatibility, and facilitating its rapid adoption as the future standard for top-side cooling solutions.

By enabling a more compact PCB design and reducing the system footprint, the SSO10T package decreases the cost associated with cooling designs by removing the need for vias. This results in lower overall system costs and design effort, while the housing itself offers high power density and efficiency. These features support the development of vehicles that are both future-proof and sustainable.

Availability

The first automotive MOSFET products featuring the 40V SSO10T technology are now on the market, including models IAUCN04S6N007T, IAUCN04S6N009T, IAUCN04S6N013T, and IAUCN04S6N017T.