Power

Intelligent power module for solder-free assembly from Semikron

12th June 2008
ES Admin
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Semikron has introduced the MiniSKiiP IPM intelligent power module for quick and easy solder-free assembly. The module has been developed for motor power up to 15kW and incorporates a latch-up free Silicon on Insulator (SOI) driver IC for reliable system operation. Compared to other intelligent power modules, this new unit features the lowest thermal resistance of 0.95K/W and the highest junction temperature of +175°C.
Power, control and auxiliary contacts are connected directly to the printed circuit board via springs, not solder joints. This results in a higher quality of assembly. Cost-efficient assembly of module, printed circuit board and heat sink is achieved with simple snap-on mounting with one standard screw. The user has the advantage of using a module where handling is reduced and the parts count is lower, compared to discrete designs.

A high-voltage driver IC with advanced level-shifter technology is integrated into the 600V Converter-Inverter-Brake and 1200V inverter (6-pack) modules, providing IGBT driving without an optocoupler. The SOI technology provides complete latch-up immunity, since all switches are dielectrically insulated. A level shifter for each channel allows the presence of negative secondary offset voltages. The integrated gate driver remains fully operational for any applied offset voltage down to -50V, providing flexibility in the design of a power system. The gate driver IC features over-current shut-down circuit protection by using an external shunt resistor in the ground plane – shutting down the IPM in case of over-current – as well as an under-voltage lockout for all channels and fault signalling. A shut-down can also be forced by the system controller, using the shut-down input. Logic interlock protection is included to ensure that simultaneous conduction of the IGBTs in a phase leg cannot occur.

The MiniSKiiP IPM achieves the best thermal resistance and an optimised current density, leading to high power-cycling capability and a longer lifetime compared to existing IPM technologies. These advantages are the result of the pressure contact technology which evenly distributes the vertical pressure, the spring contacts and the baseplate-free package.

MiniSKiiP IPM is suitable for industrial and consumer drives up to 15kW as well as process control and solar applications. Using state-of-the-art Trench-Field-Stop IGBTs, the IPMs are available in 600V and 1200V versions and have been designed for nominal current ratings up to 72A. The modules are RoHS compliant.

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