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Infineon unveils next-gen high-density power modules for VPD in AI data centres
10th March 2025
Sheryl Miles
Infineon Technologies has launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute. Through enhanced system performance and with Infineon’s trademark robustness, the new TDM2454xx quad-phase power modules enable best-in-class power density and total-cost-of-ownership (TCO) for AI data centres operators.
The TDM2454xx quad-phase power modules enable true vertical power delivery (VPD) and offer current density of two Ampere per mm2. The modules follow the TDM2254xD and the TDM2354xD dual-phase power modules introduced by Infineon last year, and continue to enable superior power density for accelerated compute platforms. In traditional horizontal power delivery systems, power needs to travel across the surface of the semiconductor wafer, which can result in higher resistance and significant power loss. Vertical power delivery minimises the distance that power needs to travel, thereby reducing resistive losses enabling increased system performance.
Data centres are currently responsible for 2% of global energy consumption according to the IEA. Fuelled by AI, the power demands within data centres are expected to grow by 165% between 2023 and 2030. Continually improving the efficiency and power densities of power conversion from grid-to-core is vital to enable further advancements in compute performance while reducing TCO.
“We are proud to expand our high-performance AI data centre solutions with the TDM2454xx VPD modules,” said Rakesh Renganathan, Vice President Power ICs at Infineon Technologies. “We take a three-dimensional design approach and leverage our industry-leading power devices, packaging technologies and extensive systems expertise to provide high-performance and energy-efficient computing solutions as part of our mission to drive digitalisation and decarbonisation.”
The TDM2454xx modules are a fusion of Infineon's robust OptiMOS 6 trench technology, chip-embedded package for superior electrical and thermal efficiencies, and innovative low-profile magnetic design that continue to push the envelope for performance and quality of VPD systems. Additionally, the TDM2454xx has a footprint that is designed to enable module tiling and improving current flow that enhance electrical, thermal, and mechanical performance. The TDM2454xx modules support up to 280A across four phases with an integrated embedded capacitor layer within a small 10 x 9mm² form factor. Combined with Infineon's XDP controllers, they offer a robust power solution with improved system power density.
