Infineon Introduces EconoDUAL 3 Power Modules with Automotive Qualification, Offering Both Highest Power Density and Reliability

“Extending the well-established EconoDUAL™ 3 family by fully automotive qualified products, Infineon takes full advantage of its decade-long experience both in developing and producing IGBT modules as well as handling and fulfilling specific automotive requirements,” says Zhang Xi, Manager Technical and Product Marketing at Infineon Technologies. “In addition, the further improved reliability specifications fulfill even highest demands of extremely demanding applications.”

The optimized design and assembly technology of the new automotive qualified EconoDUAL™ 3 modules enables a more than three times higher thermal cycling capability, while the thermal shock capability is increased by a factor of ten compared to the industry standard. With excellent mechanical robustness and power cycling capability, as well as the option of PressFit pins, Infineon offers a reliable, cost effective solution for various applications in vehicles.

The modules of the EconoDUAL™ 3 series offer the highest power density (up to 600A/1200V) available within this module footprint. The modules provide superior switching performance while copper wire bonding leads to a reduced internal lead resistance. With the use of copper bonding technology as well as an improved DCB the output power can be increased by up to 30% when compared to the related 450A version.

To facilitate logistics handling and traceability, all Infineon IGBT modules are considered as unique and fully-labeled on the modules. In case of the newly presented EconoDUAL™ 3 modules, integrated DMX code chips provide the possibility of an even enhanced traceability for automated identification of the assembled components.

Availability
Samples of the automotive qualified EconoDUAL™ 3 modules FF400R12ME4A_B11 (400A, 1200V) and FF600R12ME4A_B11 (600A, 1200V) will be available in Q4 2013, with volume production planned in the second half of 2014.