Infineon - Compact IGBT Modules with Highest Power Density and Reliability

“Introducing the two new modules in the proven PrimePACK and EconoDual families, Infineon once again underlines its technological leadership in offering IGBT modules with highest power density for energy-efficient, compact designs,” says Martin Hierholzer, Vice President and General Manager Industrial Power at Infineon Technologies.

The new PrimePACK 3 module with the designation FF1400R17IP4 with 1400A in 1700V significantly widens the power range of the PrimePACK family. Target applications are, for instance, renewable energies, traction applications, CAV (Construction, Commercial and Agriculture Vehicles) and powerful industrial drives. The new IGBT module addresses the rapidly growing requirements in the market for higher power within the same compact dimensions, paired with highest reliability. The dimensions of the PrimePACK 3 are 89mm x 250mm. The new PrimePACK 3 module – like the entire family of products – has an intelligent, optimised chip layout and module design. This innovative packaging concept results in an improved distribution and dissipation of heat, reduced thermal transfer resistance between base plate and heatsink, and minimal internal leakage inductance.

The new EconoDUAL 3 module with the designation FF600R12ME4 is at present the most powerful product in the popular EconoDUAL family, offering 600A in 1200V. Typical applications are frequency converters in automation drive systems, central inverters in photovoltaic systems, and diesel generator drives in vehicles (CAV). The optimised module design with regard to interconnection technology and thermal resistance, results in high current utilisation and thus high efficiency. With the EconoDUAL 3 FF600R12ME4, the user can increase the power range by up to 30%, while the package dimensions remain the same. In addition to the familiar soldered version of the control contacts, the highly reliable PressFIT contact technology has been introduced in the EconoDUAL 3 family.