Infineon Introduces DrBlade, the New Generation DrMOS in Innovative Chip-Embedded Packaging Technology

The MOSFET technology features lowest area specific resistance and application specific optimized Figures of Merit to achieve highest efficiency in DC/DC voltage regulation systems for computing and telecom, including Blade and Rack servers, PC-motherboards, notebooks and game consoles.

New Blade packaging technology

Infineon`s highly innovative Blade packaging technology is based on chip embedding concepts. Standard packaging processes like wire or clip bonding, as well as common molding techniques, are replaced with galvanic processes. The die also is protected by a laminate foil. The results are a significantly reduced package footprint, package resistance and inductance, as well as low thermal resistance.

“Infineon is the first semiconductor company to introduce an integrated driver and MOSFET halfbridge in Blade technology. DrBlade is another proof of our leading role in power semiconductors, making server applications highly efficient over the whole load range,” said Richard Kuncic, Senior Director Low Voltage Power Conversion at Infineon Technologies.

Saving space and gaining efficiency

The DrBlade package measures 5x5mm and has a low profile of 0.5mm, fulfilling demand for higher power density and space saving in computing systems. Due to the optimized pin assignment DrBlade enables a simplified PCB layout. The new chip-embedded packaging technology in combination with OptiMOS MOSFETs by Infineon makes DrBlade the best solution for voltage regulators in the low-voltage segment.

Availability & Pricing

Samples of DrBlade are now available, with production devices available in the second quarter of 2013.