Infineon launches new 4.5kV modules in IHV portfolio

20th August 2013

Nat Bowers

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Infineon Technologies have today announced the introduction of the new 4.5kV modules that expand its IHV portfolio. The 4.5kV IHV modules are reliable and robust with lower conduction and switching losses and the highest power density. The highly insulating 6.5 kV housing offers enhanced protection by means of greater creepage and clearance distance and can be used in demanding environments.

Björn Rentemeister, responsible marketing manager in the Industrial Power Control Division of Infineon, comments: "With our new high-power product we are aiming at the international market for rail vehicles. Due to the steady trend toward higher mobility, we expect demand to continue to rise worldwide. For this reason the IHV A module is produced in a housing standard that is accepted worldwide which allows rapid and simple implementation by the customer in both new and already existing designs."

The module now available is based on an IGBT 3 with trench field stop technology and a field stop diode. In combination with a base plate made of aluminium-silicon carbide with a low expansion coefficient and high thermal conductivity, it guarantees low conduction and switching losses and thus high energy efficiency combined with robustness.

The module is designed for current between 400 and 1,200A and features enhanced DC stability. It can be used in an extended temperature range from -50°C to 125°C and retains its blocking capability completely even below 0°C. Three versions of the module are currently available: the 400A DD400S45KL3_B5 in dual diode configuration; the 800A FZ800R45KL3_B5 and the 1200A FZ1200R45KL3_B5, both in single-switch configurations.

Availability and configuration

The new IHV module complements the existing product family, which currently consists of the module classes 3.3 kV, 4.5 kV and 6.5 kV, each in single-switch and dual-diode configurations. An extension of the 4.5 kV module class with a chopper and another diode configuration is planned for the beginning of 2014. For the first half of 2014 Infineon plans the launch of housing type B for applications in the area of medium voltage drives, power transmission including HVDC, and distribution and inverters for wind power stations.

With the now extended product family Infineon can offer a broad IHV portfolio with different customer-specific topologies on a standardized platform. Combined with the robustness, high reliability and energy efficiency of the modules, the result is competitive system costs for the customer. Customers also benefit from a global sales organization that combines local support with the technological expertise of an international semiconductor manufacturer.