Techcon Systems Introduces New Non-Contact Jetting Technology

Every component of the valve is designed to the highest tolerances and manufactured to the strictest degree of precision, ensuring world-class accuracy and repeatability in drop-to-drop dispensing volume. Special features of the valve include fully adjustable parameter settings, allowing the operator to change the jetting properties for different fluid types and optimize the process for repeatable dispensing.

Jet Tech’s compact size and modular design aids the integration into robotic systems. A variety of nozzle shape and sizes, along with different tappet configurations, provide a wide spectrum of output jet deposits. Additionally, the valve features field replaceable spare parts with quick and easy replacement procedures. These features translate into low total cost of ownership.

The TS9000 Series Jet Tech can be used in wide range of applications including jetting silver epoxies for die bonding processes, silicone phosphor in the LED assembly process, underfill in microelectronic package applications on PCBAs, and micro dots of UV adhesive in medical device applications. The Jet Tech system is shipped standard with a valve, controller, cables and three nozzle tools.

The TS9000 Series Valve will be available for order on December 3, 2012.