Metal-Core PCB circuits with pre-applied thermal interface material accelerates assembly process

The pre-applied Bond-Ply 450 tape is expressly designed to retain its adhesive properties after passing through reflow soldering, allowing the assembly to be directly attached to a heatsink. Release of the back-side liner is also unaffected by soldering temperatures. It is available only as a pre-applied thermal interface for T-CLAD circuits. It is 0.127mm thick and is rated for continuous use from –30 to +120 degrees Celsius. High bond strength to low-energy surfaces such as aluminium heatsinks and a variety of plastics assures secure assembly, even for products used in harsh environments.

The Bond-Ply 450 is available in both standards as well as customized T-CLAD circuits. These include outlines such as power rails and star- or square-shaped LED boards, as well as a limitless variety of sizes for use in markets such as architectural, automotive, medical, military, signage or aerospace.