Innovative phase-change TIM boosts productivity and performance

Hi-Flow 330P is electrically insulating, with its polyimide reinforcing film providing dielectric strength more than 5kV and high resistance to cut through. The underside coating is a naturally tacky 52°C phase-softening compound suitable for automatic placement onto a heatsink. The topside 52°C phase-change compound is dry to the touch allowing a power-dissipating component to be attached quickly and easily using a constant-force fastener such as a clip or spring; the recommended fixing type for use with phase-change materials.

Targeting applications such as high-performance computers, notebooks, discrete devices and power modules including motor drives and IGBT arrays, Hi-Flow 330P is delivered as sheets or bulk roll compatible with automated dispensing, containing die-cut squares or rectangles for standard component sizes. Its natural tack enables easy and predictable release from the carrier liner. Three reinforcement thicknesses are available, 0.114mm, 0.127mm or 0.140mm, allowing engineers to optimise electrical insulation, resistance to cut through, and thermal impedance.