IMAPS-UK “Beyond Solder” Technical Seminar Announced

As engineers are presented with the challenge of fitting more functionality into smaller spaces, getting more power out of devices, dissipating increasing levels of heat from components and ensuring improved levels of reliability, the methods used for interconnect are often key in achieving these goals.



The IMAPS-UK “Beyond Solder” Technical Seminar investigates the different interconnection methods being used and developed today, which overcome these challenges. These include ultrasonically bonded interconnects, reliable connections for harsh environments, conductive adhesives, press-fit connections for high reliability applications, parallel welding of ultra thin wires & ribbons, innovative die attach materials, flip chip connections & nano-scale interconnects.



The Seminar will comprise eight technical presentations in four sessions, with coffee & lunch breaks in between. These will be followed by a general discussion, which will review and assess the challenges in packaging that need to be addressed for different applications. There will also be ample opportunity for networking with fellow delegates from leading companies and institutions in the UK. In addition, there is a complementary tabletop exhibition showcasing leading companies in the field.



The event is open to all, including non IMAPS-UK members; however space for the event is limited and available on a first-come, first-served basis.