A prestigious international conference and exhibition on photonics and optoelectronics packaging was held at South Devon College recently. The event was in partnership with IMAPS-UK and the Torbay Hi-Tech Cluster, with visiting international delegates.

Being held on the 21st March 2013 at TWI in Cambridge, there is only 2 weeks to go until the Microtech - IMAPS –UK Annual Conference. Pre-registration for the show is now underway click here to register. Visitors can also find out more about the range of exhibitors and presentations exclusively available to ensure they make the most of their MicroTech experience.

UK Microelectronics Packaging Society (IMAPS-UK) is pleased to announce details its forthcoming “Basic Packaging Workshop being held at TWI (The Welding Institute) on 21 & 22 June 2011.

The UK Microelectronics Packaging Society (IMAPS-UK) has announced a call for papers and abstracts for their forthcoming “iPower” event which is intended to ‘Showcase UK Power Electronics’. The event will be held on 30 November & 1 December 2011 at the University of Warwick’s prestigious IDL Conference Centre.

IMAPS-UK, the leading Industrial Society for packaging and test of microelectronic devices and related technologies is pleased to announce that Yole Développement is the keynote presenter at their forthcoming “Making MEMS Work – BIG Ideas For Small Devices” Technical Seminar. The Seminar is being held on 02 December 2010 at the Institute of System Level Integration (iSLI), Edinburgh.

UK Microelectronics Packaging Society (IMAPS-UK) is pleased to announce details its forthcoming “Making MEMS Work – BIG Ideas For Small Devices” Technical Seminar & Industry Networking Event being held at The Institute of System Level Integration (iSLI) in Edinburgh on 02 December 2010.

On 30th June 2010, IMAPS-UK held a successful one-day technical seminar in conjunction with the Innovative electronics Manufacturing Research Centre (IeMRC), at the National Physical Laboratory (NPL) in Teddington, London.

IMAPS-UK has released details of the Technical Programme for their forthcoming “Beyond Solder” Technical Seminar being held on at the National Physical Laboratory, London on the 30 June 2010. With its theme of interconnect processes, technology and materials, the event has attracted leading presenters from Companies and Institutions such as IeMRC, Henkel, TWI, Kulicke & Soffa, Panda Europe, NPL & Irisys.

IMAPS-UK, the UK Microelectronics Packaging Society has announced details of their one day technical seminar “Beyond Solder” being held at the National Physics Laboratory, London on the 30 June 2010, in conjunction with the Innovative electronics Manufacturing Research Centre (IeMRC).

UK-Prototyping to Production was the theme for a recent IMAPS-UK event held at Unisem Europe’s Advanced Semiconductor and Test facility in Crumlin, South Wales.