IMAPS-UK “Beyond Solder” Technical Seminar Proclaimed A Success

The event titled “Beyond Solder – Helping You Make Reliable Connections” provided attendees with the opportunity to learn more about the latest interconnection processes and materials, which are increasingly providing alternatives to conventional solder. The theme provoked very high levels of interest, with the Seminar selling-out four weeks prior to the event.

Eight papers were presented from leading Companies and Institutions comprising Adhesive Innovations For Component & Die Attach - Henkel, Advanced Wire Bonded Interconnects - Kulicke & Soffa, Press Fit Connections For Automotive & High Reliability Applications - Panda Europe, End of Life Options For Electronic Interconnects - NPL, Joining & Packaging Technologies For High Temperature Electronics - TWI, Bonding With Nanotechnology - Indium Corporation (Europe), Optimisation Of A Process For A Fine Pitch ICA Interconnection - Irisys and a Keynote Paper on the Benefits, Challenges & Opportunities of Solder Free Connections by IeMRC. These were followed by a General Panel Discussion in which the speakers answered a series of questions that focussed on future packaging issues and opportunities.

IMAPS-UK proclaimed the Seminar a success following excellent delegate & presenter feedback, with Professor Martin Goosey, Industrial Director of the IeMRC also congratulating the Society for organising and hosting such a successful event.