Gap filler provides industry-leading thermal performance material designed for demanding applications

Gap Pad 5000S35 uses advanced filler and resin technologies to maximise inherent thermal conductivity and reduce interfacial thermal resistance. With a hardness of 35 Shore OO, Gap Pad is the softest material currently on the market to offer thermal performance of 5W/mK.

Its visco-elastic formulation confers excellent interfacing and wet-out characteristics at low contact pressures, making it a natural choice for moving heat away from fragile components. Moreover, Gap Pad 5000S35 can conform to the most demanding contours, a vital attribute in PCB applications that require transfer of heat from components of differing heights to a single heatsink.

The use of isometric glass reinforcement within Gap Pad 5000S35 allows for easy placement and repositioning during assembly, as well as conferring inherent take and hence eliminating the need to use adhesives to achieve the required thermal performance. Unlike competing products the material will not crumble, flake or tear. It also exhibits exceptionally low extraction of 6% when subjected to ASTM G120 silicone extraction testing.

Gap Pad 5000S35 is flame retardant to UL94V-0 – the highest available rating for its material type – and is RoHS compliant. Available in thicknesses of 0.5, 1, 1.5, 2, 2.5 and 3.175mm, it is available in sheet form or die-cut to any shape or size according to customer requirements.