Pending
FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011
FINETECH will showcase the FINEPLACER Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.
The FINEPLACER Lambda is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 micron). This versatile system can be used for precise placement, die-attach and advanced packaging utilizing various bonding technologies -- soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, adhesives and UV curing. Applications include flip chip, 3-D packaging, MEMS, wafer-level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors, and more.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
