Finetech will highlight the FINEPLACER core rework system in booth #1205 at the upcoming IPC APEX EXPO, scheduled for February 19-21, 2013 at the San Diego Convention Center in California. The FINEPLACER core offers proven rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 70 x 70 mm BGAs, and handling PCBs up to 310 x 400 mm.

Finetech will showcase the sub-micron placement accuracy FINEPLACER Lambda bonder in Booth #4626 at the upcoming SPIE Photonics West exhibition, scheduled for February 5-7, 2013 at the Moscone Center in San Francisco, CA.

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER Pico MA bonder on August 15, 2012. The multi-application system with 5 micron placement accuracy is valued at $100,000. As part of its 20th anniversary celebration this year, Finetech chose to give back to the university R&D segment of its business by donating a bonder for research and education. Nearly 400 entries were received, representing 95 unive...

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum, scheduled to take place May 16, 2012 from 10 a.m.-3 p.m. at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada.

MARTIN will showcase its MINIOVEN Reball/Prebump unit, Expert 10.6 rework system and Clever Dispense unit at the upcoming IPC APEX Expo, scheduled for February 28 - March 1, 2012 at the San Diego Convention Center in California.

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International conference & exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Finetech announces that comprehensive construction measures to remodel and expand the development and manufacturing facilities at Berlin headquarters have been completed. The centerpiece of the remodeling is the new cleanroom designed to meet the highest customer demands.

At Productronica 2011, Finetech will present a number of smart improvements and new options for the FINEPLACER lambda. New optical system and illumination Although the FINEPLACER® lambda already has a reputation for providing superior optical resolution, Finetech could enhance the experience by adding new features. A whole new lighting concept now allows a separate adjustment of chip and substrate illumination. The lighting settings can be adapt...

From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.

Finetech has appointed Norm Faucher to the position of Applications Engineer effective immediately. A veteran in the electronics industry, Norm brings many years of SMT soldering expertise and customer support experience. The process knowledge he has gained from well-respected electronics assembly equipment companies will add to the strength of Finetech’s application team.

Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.

September 29 will see Finetech hold the 8th International User Meeting micro assembly in Berlin. This events series aims at prospects, users and experts alike and has become a fixed point of the annual industry calendar, attracting a steadily growing number of visitors.

SMT 2011, one of the most important European trade fairs for system integration in microelectronics, will open its doors on 3 - 5th May, 2011 in Nuremberg. For the second consecutive year, Finetech will co-exhibit with MARTIN GmbH in Hall 6, Booth 406.

FINETECH will showcase the FINEPLACER Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.

FINETECH will showcase the FINEPLACER Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

Finetech are pleased to announce that both the “Micro Assembly” User Meeting which was held in Berlin and the first ever Finetech “Advanced Rework User Meeting to be held outside Germany exceeded all expectations and can be considered a complete success.

This year, for the first time, Finetech will offer two separate International User Meetings for Micro Assembly and Rework Customers. This decision is based on the intention to ensure full commitment to the respective segment over the whole of the event.

Finetech is delighted to announce a new partnership with Gen3 Systems. With over 40 years of experience, Gen3 Systems is a globally operating original equipment manufacturer as well as specialist distributor.