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Finetech to Exhibit Innovative Solutions for Rework and Assembly Applications at SMT 2011

16th March 2011
ES Admin
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SMT 2011, one of the most important European trade fairs for system integration in microelectronics, will open its doors on 3 - 5th May, 2011 in Nuremberg. For the second consecutive year, Finetech will co-exhibit with MARTIN GmbH in Hall 6, Booth 406.
Finetech will feature selected highlights from the product range.


FINEPLACER matrix

Thanks to its modular system architecture, the FINEPLACER® matrix is an innovative assembly and rework station capable of a wide range of applications to ensure compatibility with future technology developments. The unique market concept of integrated process management (IPM) makes this machine the new reference in micro assembly and professional SMD rework.

The FINEPLACER® matrix provides a working area of 460 mm x 390 mm or wafers of up to 12, an outstanding placement accuracy of better than 3 µm, closed-loop force control, automated process operation and the ability of system-to-system process transfers, such as from R&D to production. The ergonomic design and intuitive operability, combined with simple servicing and maintenance access, further emphasizes Finetech's guiding principle of designing a machine that is aligned with the needs of the user. In the rework configuration, the FINEPLACER® matrix offers the particularly powerful hot air bottom heating RB30 and sets a new standard in the
rework of large multilayer boards.


FINEPLACER® core

Since its introduction a year ago, the FINEPLACER® core has been firmly established in the market. The FINEPLACER® core allows for safe rework of virtually the full bandwidth of typical SMD components with chip sizes ranging from 0.25 mm to 50 mm on board sizes up to 400 mm x 300 mm.
FINEPLACER® core, like all of Finetech’s rework systems, is based on superior and proven hot air soldering technology. In order to ensure a very gentle heat transfer according to IPC/JEDEC standards, the intelligent thermal management is comprised of the coordinated control of all process and environment variables as well as the harmonized interaction of top and bottom heating. With respect to components and board size, only the necessary heat is being conveyed. For optimized soldering results, FINEPLACER® core supports the use of nitrogen and other process gases.
Thanks to its compact design, the FINEPLACER® core does not compromise with respect to its functional range either. Quite on the contrary, it efficiently supports all functionalities of a future-proof rework system. The full rework cycle can be integrated into the machine, including de-soldering and soldering, component removal and site cleaning, re-balling (array), paste printing (component or board), paste dipping and fluxing. In particular, small and medium enterprises will find a versatile and universal solution with an unbeatable range of applications at an attractive price.

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