Conductive Adhesive Withstands Severe Conditions

14th February 2008

ES Admin

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Master Bond EP11SIC is a cost effective, silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity .It offers the application convenience of a one component system in addition to flexible cure schedules so as to best meet specific processing requirements. It has superior adhesion to both metallic and nonmetallic substrates with a tensile strength greater than 6,000 psi and a tensile shear strength over 1,500 psi. EP11SIC is tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals. It is recommended for bonding, potting, sealing and coating over the wide temperature range of -50°C to over 150°C.

Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste. The gel time at 150°C is in the order of 20-25 minutes while cure is on the order of 40-50 minutes at 175°C. Typical performance properties include a very low volume resistivity less than 0.001 ohm-cm, a surface resistance of less than 1 ohms/square and a very robust thermal conductivity of 7.9 W/meter-°K (55 BTU/in/hr/ft2/°F). Master Bond Polymer System EP11SIC is particularly well suited for making electrically conductive connections in sensitive electronic/electrical components which are expected to withstand severe service conditions. Its physical strength and toughness permit it to adjust to both mechanical and thermal stresses without damaging such components.

For further information please visit our website at www.masterbond.com or contact: Sheila Frankel: Phone: +44-207-100-7251 Fax: +44-207-060-0628 E-mail: eutech@masterbond.com