EUMW 2016: 3D stack technology-based components in the spotlight
A recent addition to the Aspen Electronics portfolio will be featured at European Microwave Week in London (October 4-6). RN2 Technologies specialise in multi-layered circuit design and manufacturing processes using LTCC, HTCC, AlN, and Ferrite material.
With 3 dimensional stack technology and using Ag and Cu to make the electric circuits, they can make a number of passive components, like couplers, terminations and attenuators, and circuits in small chip sizes and substrates up to 6GHz.
The adjoining Aspen Electronics Test & Measurement stand, number 132 will feature a selection of RF & Microwave test products. Aspen experts will be on hand across both stands to help and can advise on configuring systems for customer-specific applications.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
