Next-gen connectivity with high-precision CPO technology

At booth B126, the company will showcase its latest technological advancements in Silicon Photonics and Co-Packaged Optics (CPO) solutions, designed to enhance bandwidth density, improve energy efficiency, and optimise connectivity in modern data centres.

Co-Packaged Optics (CPO) is an innovative technology that integrates optical and electronic components within a single package. By utilising advanced packaging techniques, CPO minimises electrical interconnect lengths and enhances performance, making it ideal for high-speed data transmission in applications such as AI, IoT, and 5G. This positions CPO as a critical optoelectronics technology in today’s market.

Dr. Johann Weinhaendler, General Manager at ASMPT AMICRA, stated: “Many electronics manufacturers are upgrading their lines to meet the growing demand in areas like optoelectronics or advanced packaging, particularly in the silicon photonics sector.”

The production of Co-Packaged Optics presents several challenges, including the precise alignment of optical and electronic elements and ensuring reliability under diverse conditions. ASMPT is addressing these hurdles through advanced manufacturing technologies that facilitate high-precision bonding, ensuring effective integration of components and leading to enhanced stability and performance in CPO applications.

At ECOC 2024, ASMPT will highlight their leading-edge CPO solution, spotlighting the AMICRA NANO and AMICRA NOVA Pro. This demonstration not only sets new benchmarks for the industry but also reaffirms ASMPT's dedication to delivering solutions tailored for the optoelectronics sector.

AMICRA NANO, the first in the industry to achieve a placement accuracy of < ± 0.2μm at 3 sigma, is renowned for its unmatched and unparalleled accuracy. It firmly establishes the AMICRA NANO as a game-changer, revolutionising the optoelectronics landscape. AMICRA NOVA Pro represents a pinnacle in die bonding systems, delivering exceptional placement accuracy of < ± 1μm at 3 sigma. Engineered to optimise production efficiency, it offers shorter cycle times and increased automation, making it an ideal solution for the rigorous demands of CPO manufacturing. This technology enables manufacturers to streamline their processes while maintaining the high precision necessary for effective integration.