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Siemens' platform certified by GF's PDKs

4th October 2024
Caitlin Gittins
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Siemens Digital Industries Software has announced that GlobalFoundries (GF) has certified Siemens' Analog FastSPICE (AFS) platform for its 22FDX, 22FDX+, 12LP, and 12LP+ Process Design Kits (PDKs). 

These certifications allow shared customers to take full advantage of the performance and power efficiency offered by GF’s processes when using Siemens' AFS tool.

AFS forms part of Siemens' Solido Simulation Suite, delivering advanced circuit verification for nanometre analogue, radio frequency (RF), mixed-signal, memory, and custom digital circuits. This established Siemens EDA solution offers a unified platform for the integrated circuit (IC) design sector, enabling mixed-signal and variation-aware verification with SPICE-level accuracy, high performance, large capacity, and ease of use.

“Siemens is pleased to collaborate with GlobalFoundries as we continue to deliver advanced technologies that help our shared customers deliver innovative and compelling ICs to market more quickly,” said Amit Gupta, General Manager, Custom IC Verification, Siemens Digital Industries Software. “We look forward to the successful end-products that our customers can soon develop with this new design solution kit.”

GF’s 12nm FinFET platform, which employs FinFET technology, facilitates high-performance SoC integration with low-power memory and logic, and supports seamless integration of digital and analogue circuitry. This platform is particularly suited for applications such as wireless communications, sensor interfaces, and automotive electronics. Siemens' AFS platform is now certified for GF’s 12LP and 12LP+ processes. Moreover, Siemens and GF are actively collaborating with the Si2 Compact Model Coalition (CMC) on the development of the Open Model Interface (OMI), a standard platform that supports ageing modelling and reliability analysis. GF’s 12LP and 12LP+ processes now support OMI.

Siemens’ AFS platform has also been certified for 22FDX+, an enhanced version of GF’s 22FDX platform that offers improved performance and power efficiency. Both 22FDX and 22FDX+ use FD-SOI technology, known for delivering high performance, minimal leakage, and superior power efficiency. These platforms support the seamless integration of digital and analogue circuitry, making them ideal for use in wireless communications, sensor interfaces, and automotive electronics.

“Our ongoing collaboration with Siemens continues to deliver strong value for our shared customers and the broader GlobalFoundries ecosystem,” added Richard Trihy, Senior Vice President of Design Technology Enablement at GF. “With our combined expertise and dedication to innovation, GF and Siemens EDA are shaping the future of manufacturing and beyond.”

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