Siemens introduces AI-powered suite

This suite aims to significantly expedite critical design and verification tasks for the next generation of analogue, mixed-signal, and custom IC designs.

Solido Sim is built upon Siemens' established and foundry-certified Analog FastSPICE (AFS) platform. It includes three new simulators: Solido SPICE, Solido FastSPICE, and Solido LibSPICE, in addition to the well-regarded AFS platform, ELDO software, and Symphony software.

"Solido Simulation Suite, featuring AI-accelerated SPICE and FastSPICE engines, represents a significant leap forward in custom IC simulation technology, providing unmatched accuracy and efficiency for chip design and verification engineers,” said Michael Ellow, CEO, Silicon Systems, Siemens Digital Industries Software. "Our initial Solido Sim customers have experienced remarkable success across multiple processes technology platforms, all while demonstrating faster runtimes and enabling compelling new capabilities for their next-generation analog, RF, mixed-signal and library IP designs.”

Engineered to help IC design teams meet stringent specifications, verification coverage metrics, and time-to-market requirements, Solido Sim offers comprehensive application coverage with top-tier circuit and System-on-a-Chip (SoC) verification capabilities. Leveraging AI technologies, Solido Sim is designed with advanced process technologies and complex IC structures in mind, providing the necessary toolsets and capabilities to achieve accurate signal and power integrity goals.

Solido Sim features an intuitive use model, accelerated verification, and a unified workflow. It delivers a compelling array of innovative simulation technologies, including:

• Solido SPICE: Siemens’ next-generation, feature-rich SPICE simulation technology, offering a 2-30x speedup for analogue, mixed-signal, RF, and 3D IC verification. With new convergence, cache-efficient algorithms, and high multi-core scalability, Solido SPICE provides a significant performance boost for large pre- or post-layout designs. RF IC developers can benefit from Solido SPICE's new RF verification capabilities, while multi-die, 2.5D, 3D, and memory interface developers can experience efficient full-channel transceiver verification

• Solido FastSPICE: Siemens’ advanced Fast SPICE simulation technology, providing substantial speed improvements for SoC, memory, and analogue functional verification. It offers a dynamic model for SPICE-to-Fast SPICE scaling, helping achieve speed goals with predictable accuracy. Solido FastSPICE includes multi-resolution technology for differentiated performance and SPICE-accurate waveforms during critical path analysis for memory and analogue characterisation

• Solido LibSPICE: Siemens’ specialised batch solver technology for small designs, optimised for Library IP applications. Integrated into Siemens’ Solido Design Environment and Solido Characterization Suite, Solido LibSPICE enables a seamless and robust verification process for standard cells and memory bit-cells

All three solvers are powered by Solido Sim AI, Siemens’ latest AI-accelerated simulation technology. Solido Sim AI advances circuit simulation with self-verifying algorithms tuned to SPICE accuracy, providing substantial acceleration using existing foundry-certified device models without modification.

Solido Sim integrates seamlessly within Siemens’ Solido Design Environment and Characterization Suite, offering superior performance with optimal accuracy, improved productivity, and scalability across cloud infrastructures. Additionally, Solido Simulation Suite integrates with Siemens’ industry-leading IC sign-off flows, including the Calibre platform, Tessent Test solutions, and electronic systems design and manufacturing PCB solutions, providing comprehensive verification solutions across applications.