Test & inspection portfolio to be showcased at SMT Hybrid Packaging

This Nordson DAGE AXI system offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Suitable for in-line or off-line operation, the Xi3400’s innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

Using the Nordson DAGE Digitial Tomosynthesis Technology the Xi3400 acquires multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection.

The 2^nd gen Nordson DAGE 4000Plus bondtester will showcase camera assist automation. Built around a multi-function cartridge, the camera assist automation system is suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.  Easy programming using fiducial camera assist and vector stage nudge buttons provides precise X-Y alignment and facilitates rapid changeover for a variety of bond testing applications.

Also at the show will be the Nordson DAGE XD7600NT Diamond FP X-ray inspection system with QuickView CT that utilises the latest technology to provide the choice for high quality X-ray imaging. For more information about Nordson DAGE, visit Booth 7A-131 at the Nuremberg show.