Techcon Systems to exhibit at Bondexpo
Techcon Systems announced plans to exhibit in hall 9, booth 9606 at the Bondexpo, scheduled to take place Oct. 10-13, 2016 in Stuttgart, Germany. The company will showcase its new Custom Filling Service at the show. With the Custom Filling Service, Techcon offers repackaging services, which are customised and designed to meet the requirements of the individual dispensing application.
Techcon can fill one part or multi-component liquid to pasty materials into just about any container, bag, tube, cartridge, syringe or bottle. As part of the Custom Filling Service, Techcon also provides accurate mixing equipment and dry plastic containers.
Company representatives also will showcase consumable plastic containers, including cartridges, syringes, Techkits, squeeze bottles and clever barrier bags.
Techcon’s German-based repackaging partner, Lohnpack, will be at the show right next to the Techcon booth. In addition, three of the company’s distributors, including APM Technica, Globaco and AAT Aston, will be exhibiting and available to answer questions.
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