Surface measurement platform on show at SMT Hybrid Packaging
Akrometrix will display its latest surface measurement equipment platform, the CXP, on the Microtronic Booth (7-101L) at SMT Hybrid Packaging, which is scheduled to take place from 5th to 7th May 2015.
Microtronic now offers Akrometrix CXP, powered by Studio Software. The CXP addresses EMS and PCB market needs for affordable surface characterisation of PCB local areas under reflow conditions according to the company. The capabilities of the CXP tool make it a cost-effective solution for EMS and PCB companies to apply the new IPC 9641 standard, concerning warpage measurement of PCB surface mount regions.
For 20 years, Akrometrix has supported the electronics industry through services and products that measure the warpage of packages used in surface mount assemblies. While this has been crucial for product yield and reliability, warpage of PCB land areas has typically not been fully understood. The recently finalised IPC 9641 industry standard brings to the forefront the need for warpage measurement to be performed on the PCB side of surface mount assemblies.
Warpage results collected with the CXP from PCB land areas can be compared to corresponding component warpage through the use of the Akrometrix Interface Analysis software solution, which enables shape matching and interconnect gap analysis at critical temperatures throughout a reflow cycle.
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