Soldering and rework system on show at SMT 2014

29th April 2014

Metcal

Nat Bowers

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Datasheet

At SMT Hybrid Packaging 2014, May 6-8 in Nuremberg, Germany, Metcal will showcase its portfolio of products in Booth #9-327. One highlighted product is the MX-500 Soldering and Rework System, which has been updated to include additional features and a new look. It retains switchable dual port, 40W operation while introducing numerous new features in a new housing.

Built upon SmartHeat Technology, the MX-500 assures extremely responsive and highly controlled heating delivering the exact energy needed to ensure a precise and reliable solder connection.

Also on display will be the HCT2-120 Digital Hot Air Pencil. It boasts a 120W ceramic heater and dual stage air pump that provides the power and performance needed to deliver the right amount of thermal energy. Additionally, two LED displays provide graphical and numerical representation of the desired airflow and temperature. The Digital Hot Air Pencil also includes a pack of six nozzles, work stand with nozzle plate holder, and a nozzle removal pad.

Gary Stoffer, Global Director, Sales and Marketing, MEK, commented: "The Digital Hot Air Pencil is ideally suited for applications which use smaller components and integrated circuits. The HCT2-120 hand-held convection tool allows users more freedom to access and rework components on the board without affecting adjacent parts.”

Also on display, the modular Scorpion Rework System allows for simultaneous viewing of Printed Circuit Board (PCB) pads and component pads or balls for the accurate placement of BGAs. The Scorpion can create specifically tailored reflow profiles through Metcal’s unique convection heating technology with nozzle and dual-zone pre-heater in one user-friendly, single platform rework system.