SMT Hybrid Packaging to feature an 'open source' workshop
SMT Hybrid Packaging 2015 will feature a new workshop concept. The Open Source Workshop, which is scheduled to take place on Wednesday 6th May, will encourage all participants actively discuss three different subject areas of the ‘Challenges of 3D-IC Integration for PCB Technologies’.
Each group will be supervised by a moderator who will guide the time-limited discussions in the respective subject areas. After the show, the results will be summarised and made available to the participants. This workshop aims to provide a platform for topics with open questions and so far no generally accepted solutions.
The German-speaking conference will take place on Wednesday and Thursday morning, allowing participants sufficient time to visit the exhibition and inform themselves about the most recent products and technology trends. On Wednesday, international experts will present the topic ‘High frequency assemblies - no bit is neglected during processing and transmission’. On Thursday the topic ‘Technologies for photonic systems – where electronics can go no further’ will be discussed.
In addition to the conference, the programme includes a total of 17 practical oriented half-day tutorials in German and English language. They cover relevant questions and challenges along the entire supply chain of electronic assembly, from design via process technology to quality assurance. The English-speaking workshop on Thursday will highlight the topic ‘Manufacturing the internet of things’.
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