SMT Hybrid Packaging 2016, scheduled to take place from 26th to 28th April in Nuremberg, Germany, already has the same number of exhibitor registrations than the 2015 edition, seven months before the show! The numerous responses to the pre-registration deadline emphasises the significance of the event for the industry.

SMT Hybrid Packaging's Call for Tutorials invites experts from industry and academia to submit abstracts relating to system integration in microelectronics. Deadline for any submissions is 5th October 2015.

From the 5th to 7th May 2015 the industry met in Nuremberg, Germany and took advantage of the platform for information and knowledge exchange. According to the visitor survey of the SMT Hybrid Packaging 2015 the main visitors interest laid in assembly systems, solder technologies and test. 92 % of all surveyed visitors indicated, that they have found products and/or solutions for their company.

After three intense exhibition days, the recent hall layout has proved to be successful. Despite the rail strike, around 15,000 trade visitors went to the SMT Hybrid Packaging fair in Nuremberg and benefited from the latest developments and trends in the industry. These were presented by 470 renowned national and international companies.

For the first time, SMT Hybrid Packaging will host a hand soldering competition in hall 7, stand 500. The main prize is a place in the Hand Soldering Competition 2016, which takes place in Las Vegas. The prize will include flights and accommodation, as well as a cash award of €300.00.

Two conference sessions, two workshops and 17 German and English tutorials concerning all aspects of system integration in microelectronics make up the programme at SMT Hybrid Packaging 2015 on 5th to 7th May.

SMT Hybrid Packaging 2015 will feature a new workshop concept. The Open Source Workshop, which is scheduled to take place on Wednesday 6th May, will encourage all participants actively discuss three different subject areas of the ‘Challenges of 3D-IC Integration for PCB Technologies’.

The SMT Hybrid Packaging International Exhibition and Conference for System Integration in Micro Electronics, Nuremberg, 6-8 May 2014, will feature several special topics presented with their own exhibition areas. The production line of the Fraunhofer IZM in Hall 6 will be dedicated to "Industry 4.0 - With new Technologies towards lot size 1".

As a result of many suggestions at last years show, the concept of the joint "EMS Service Point" stand has been revised. Now relabelled as "EMS Intersection", this stand offers more floor space and stands, as well as other benefits, for contract manufacturers. Already, 50% of the units of this new platform are occupied.