SMT Hybrid Packaging features special open workshop
Two conference sessions, two workshops and 17 German and English tutorials concerning all aspects of system integration in microelectronics make up the programme at SMT Hybrid Packaging 2015 on 5th to 7th May.
Special highlight of the event is the Open Source Workshop on Wednesday afternoon dealing with the 'Challenges of 3D-IC-Integration for PCB Technologies. Workshop language will be in German. Further highlights are the two German conference sessions with the topics High frequency assemblies, No bit is neglected during processing and transmission and Technologies for photonic systems, where electronics can go no further.
In addition, the English workshop manufacturing the IoT analyses the influence of Industry 4.0 on electronics manufacturing with insights into the opportunities and challenges for the EMS supply chain.
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Analog Devices Inc.
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Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
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