Events News
SMT Hybrid Packaging 2016's call for tutorials extended
The abstract submission deadline for the Call for Tutorials of SMT Hybrid Packaging 2016 has been extended until the 19th October 2015. SMT Hybrid Packaging takes place from 26th to 28th April 2016 in Nuremberg.
Abstracts can be submitted for various topic areas defined by the conference committee, chaired by Prof. Dr. Klaus-Dieter Lang of Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin:
- Interconnection technology;
- Reliability and quality of PCBs;
- Process optimisation and traceability, competitiveness;
- New materials, materials development & material efficiency;
- Assembly of electronic components;
- Packaging and system integration;
- Power electronics and high temperature PCB;
- 3D integration technologies;
- Design and development tools;
- Printed electronics;
- Manufacturing logistics, equipment optimisation and Overall Equipment Effectiveness (OEE);
- Power LED systems and photonic boards;
- Environment, energy efficiency & disposal;
- Flex and rigid-flex PCB;
- Panel level packaging; and
- Component standardisation.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
