Due to the pandemic, Formnext Connect, the digital version of Formnext, an event showcasing additive manufacturing and industrial 3D printing, made its debut from 10th to 12th November 2020. The success of the virtual event exceeded all expectations and shows the potential and benefits of digital communication platforms for all participants.

The latest edition of Automotive Maintenance and Repair Expo (AMR) will take place from 21st-24th March 2019 in Beijing’s New China International Exhibition Centre. The fair has expanded many of its special zones for 2019, and for the first time will host a new German Pavilion. The show’s latest addition will allow buyers to explore a more comprehensive exhibiting platform, and will enable them to connect with some of the most in...

Automechanika Kuala Lumpur will feature multiple fringe events highlighting the potential of IoT technologies to reduce maintenance costs and improve road safety, show organisers have announced. The trade fair attracted 246 exhibitors and more than 5,600 visitors to the previous edition. Continuing its success, 2019 will see an estimated 300 exhibitors to the Kuala Lumpur Convention Centre from 21st-23rd March 2019.

SMT Hybrid Packaging has broadend its contacts in industry by cooperating with the SMTA (Surface Mount Technology Association) and the German Chapter of IEEE-CPMT. The aim is the increase of global visibility for all cooperating partners.

Top speakers from industry and science present their latest research results and developments during the two-day conference of Smart Systems Integration in Munich / Germany from 9th – 10th March 2016.

PCIM Asia, the international meeting point for experts of power electronics in China, offers 2016 for the first time a Newcomer Pavilion for new exhibitors. With reasonable rates and manageable efforts mainly small and medium sized companies are now able to present themselves at the most important trade show for power electronics in Asia. PCIM Asia offers direct access to all present topics of power electronics in the booming market China. Many f...

The abstract submission deadline for the Call for Tutorials of SMT Hybrid Packaging 2016 has been extended until the 19th October 2015. SMT Hybrid Packaging takes place from 26th to 28th April 2016 in Nuremberg.

Due to the ongoing demand, the period to submit abstracts for the Call for Papers of Smart Systems Integration 2016 has been extended. Speakers may submit abstracts and help to shape the conference programme until 20th October 2015. Call for Papers submission requirements and further information are available on the website.

The Call for Papers of Smart Systems Integration 2016 is now open. The event, which will take place in Munich, Germany 9th to 10th March 2016, will be once again the key platform for the Smart Systems Integration industry to meet and discuss current issues. Deadline to submit abstracts is 5th October 2015.

271 experts from 21 countries met on the 11th and 12th March 2015 in Copenhagen / Denmark to inform themselves in six keynotes, a panel discussion and 55 lectures on the latest applications and trends on the topic Smart systems integration and to visit the accompanying exhibition. The conference was conducted in 2013 with the MEMS Industry Group. This underlines the importance of the smart systems integration conference and exhibition for this in...