SMT Hybrid Packaging 2016: Call for Tutorials open

SMT Hybrid Packaging is the international meeting place for products and services along the entire value chain of electronics manufacturing, from research via materials and components to manufacturing and test equipment. In two half-day sessions, the conference analyses cutting-edge topics of modern system integration and its applications. The tutorials provide basic and technical knowledge with a practical focus.

Abstracts can be submitted for various topic areas defined by the conference committee, chaired by Prof. Dr. Klaus-Dieter Lang of Fraunhofer Institute for Reliability and Microintegration (IZM):

1. Interconnection technology
2. Soldering
3. Adhesive bonding
4. DIE and wire bonding, flip chip
5. Application techniques
6. Sintering
7. Crimping
8. Reliability and quality of printed circuit boards
9. Process optimization and traceability, competitiveness
10. New materials, materials development, material efficiency
11. Assembly of electronic components
12. Packaging and system integration
13. Power electronics and high temperature PCB
14. 3-D integration technologies
15. Design and development tools
16. Printed electronics
17. Manufacturing logistics, equipment optimization and Overall Equipment Effectiveness (OEE)
18. Power LED systems and photonic boards
19. Environment, energy efficiency, disposal
20. Flex and rigid-flex PCB
21. Panel level packaging
22. Component standardization

SMT Hybrid Packaging takes place from 26^th to 28^th April 2016, in Nuremberg.