SMT Hybrid Packaging 2015: A worthwhile package for visitors

470 exhibiting companies from Germany and abroad offered trade visitors the opportunity to gather information about new products and trends in a face to face discussion.

Leader of the visited highlights according to the visitor survey is the production line, organized by Fraunhofer IZM, with 68% of the visitors. Followed by the High Tech PCB Area with 31% visitors and the 3-D MID joint stand with 28% visitors. The special EMS Intersection and Optics meets Electronics joint stands were visited by 20% of the trade visitors.

The visitor statements confirm the hyigh importance of the SMT Hybrid Packaging in the field of system integration in microelectronics in the European market: "SMT Hybrid Packaging 2015 the place where innovation and experience come together as a complete package.” Commented Paul Bigyilan, PCBA Area Coordinator, Hella Romania, Romania.

"One of the best exhibitions in Europe for electronics manufacturing,” said Gábor Futó, Head of Industrial Engineering, BALLUFF Elektronika Kft, Hungary.

"We really benefited from visiting SMT in Nuremberg this year: we met up with friends and colleagues, shared experiences and discovered what's new in the field of electronics and SMD and THT assembly. Thank you!“ added Stefan Bozhkov, Sales Engineer, AMTEST EOOD, Bulgaria.

The SMT Hybrid Packaging 2016, international Exhibition and Conference, will take place from 26^th to 28^th April 2016 in Nuremberg, Germany.