Samtec will showcase interconnect solutions at OCP Summit

This event, organised by the Open Compute Project Foundation (OCP), highlights the latest advancements in open hardware and software. The summit will take place in San Jose, California, from 15-17 October 2024, and focuses on driving innovation that leads to practical, real-world solutions.

Samtec works closely with its customers and partners to develop innovative interconnect solutions that address specific real-world challenges. At this year’s OCP Global Summit, Samtec will introduce the FireFly OCP OAI EXP Module. This module features 16 FireFly optical transceivers, delivering an aggregate throughput of 1.6 Gbps. The FireFly module is protocol-agnostic, supporting Ethernet, PCIe, and CXL over optics, and typically consumes half the power of MSA-style optics. A complete OAI system design could accommodate up to 8 FireFly OAI EXP Module cards.

The FireFly OCP OAI EXP Module also benefits from technology provided by US Conec, whose very small form factor (VSFF) MMC optical connectors allow Samtec to achieve the high fibre density required for the OCP card form factor. US Conec’s DirectConec™ push-pull boot technology ensures effortless insertion and removal of connectors in dense environments.

“US Conec’s MMC technology brings unparalleled optical density to the FireFly OCP OAI EXP Module,” commented Tom Mitcheltree, Advanced Technology Manager at US Conec. “With the integration of the MMC connector platform into Samtec’s FireFly high density connectivity solution, our collaboration will bring high-quality, innovative solutions to the datacenter market.”