Samtec to showcase interconnects at electronica 2024

Occurring every two years, electronica (12-15 November) attracts approximately 70,000 attendees to Munich, Germany from over 100 countries. Samtec regularly exhibits at electronica and this year will have live booth demonstrations of industry-leading interconnect products and technology.

In booths B2-219 and B2-119, Samtec will be showcasing high-speed, high-density interconnects that are well suited for use in data centres, AI/high-performance computing, instrumentation, aerospace/defence, and telecom/edge applications up to 224 Gbps and 110 GHz.

Products featured include the new Si-FLY HD high-density Flyover system, URSA I/O ultra-rugged cable system, AcceleRate extreme density and performance systems, and Halo next-gen 56 Gbps optical system for optical or copper interconnects, CXL over optics, and PCIe. Demonstrations include high-performance mid-board, front-panel, and back-panel systems as well as precision RF products, including the sought-after BE90A Bulls Eye test system, Magnum RF ganged solution, and newly released distinctive Samtec orange Nitrowave RF microwave cable assemblies that maintain phase and amplitude stability with flexure.