Ruggedised 3D NAND modules revealed at embedded world
Manufacturer of embedded Flash and ruggedised SSD and DRAM modules, ATP Electronics, will reveal its new 3D NAND-based SATA product line up at embedded world 2017 in Nuremberg. The products have gone through stringent chip as well as module level validation tests and will be manufactured using ATP’s in-house self-packaging technology. Available form factors include 2.5”, mSATA, SlimSATA and M.2 in various capacities, including intermediate densities such as 192, 384 and 768GB.
The products will be showcased at ATP’s booth in hall 1, booth 1-655.
Benefits of 3D NAND compared to planar NAND
Higher memory capacity:
By stacking more layers vertically, greater capacities, such as 1, 1.5 and 2TB, are made possible through 3D NAND.
Lower cost per bit:
Compared to planar NAND, 3D NAND shows greater cost advantage as the capacity increases.
Increased longevity and supply flexibility through ATP's die packaging:
The high end manufacturing facility is capable of processing NAND wafer dies into ATP’s own SDP, DDP, QDP or ODP BGA packages. This simplifies supply chain planning and results in higher flexibility and better lead times. At the same time, it allows the company to offer better longevity for its products through extended wafer supply agreements with its manufacturers.
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