BGA failures under discussion at Scotland Technology event
Peter Koch, European X-Ray Application Engineer, at Nordson Dage is lined up to present at their Distributor Etek’s Technology Event, in Prestwick, Scotland (Nov 5-6). He will present “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.” Koch will discuss failures on BGAs, HiP (Head in Pillow) defects, cracks and simple failures such as solder bridges.
Most of these failures can be detected with 2D inspection; however, sometimes it is necessary to use other techniques such as X-Plane (Tomosynthesis) and CT. Also, Koch will discuss how the shape of the BGA balls or the voiding can give a good indication of the failure.
The presentation will analyse failures on different components such as resistors, capacitors and wire bonds. Nordson DAGE X-Plane and CT-images will be shown. Koch will conclude with an example of how useful X-ray can be to find a manipulation on a device.
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