Mirtec to unveil inspection technologies for solder joints at productronica

The new systems are designed to overcome challenges in 3D inspection performance, particularly in solder joint inspection, speed for tall component inspections, and measurement range limitations, thereby offering manufacturers an optimal solution for enhanced quality and productivity.

The evolution of 3D AOI: solder joint inspection reinvented

The 2011 introduction of 3D AOI systems represented a major advancement in electronics manufacturing, initially focusing on detecting lifted components on PCBs. As industry needs evolved, the demand for detailed solder joint inspection increased, especially in critical sectors like automotive, defense, and aerospace electronics manufacturing.

Mirtec's latest innovation, the Anti-Reflection Technology (ART) system, revolutionises 3D inspection by surpassing the limitations of existing systems. Featuring five 15 Megapixel Cameras and four Digital Multi-Pattern Blue Moiré Projectors, the ART system offers unmatched accuracy in solder joint inspection. Distinct from traditional systems, the ART system utilises multiple main cameras for simultaneous 3D pattern image capture, ensuring stability and precision even under challenging conditions such as light saturation and shadow interference.

The Anti-Reflection Technology significantly enhances the reliability of solder joint inspection by eliminating noise from the 3D data, providing a clear and accurate depiction of the solder joint's height and shape. Its unique design ensures comprehensive inspection coverage without any blind spots.

TAL 3D SCAN: elevating productivity for THT+SMT mixed PCB inspection

Mirtec addresses the industry's challenge in inspecting tall components on PCBs. The growing use of heavy-duty components necessitates a solution capable of accurately measuring taller components without compromising inspection speed. The TAL 3D SCAN (Tall component Analysis Laser 3D Scanner) is Mirtec's response to this need.

The TAL 3D SCAN, a dedicated 3D laser scanner attachment, is specifically designed for the precision inspection of tall components. Integrated into the PCB transport system, it scans PCBs at the initial stage while the 3D AOI operates at a subsequent stage. This dual-process approach cuts cycle time and boosts productivity by processing inspection data from the 3D laser scanner concurrently.

With its ability to measure components up to 75mm in height, the TAL 3D SCAN surpasses other 3D AOI systems, offering an unparalleled solution for THT+SMT mixed PCB inspection without necessitating Z-axis movement, thus maintaining consistent inspection speed.

A 30% productivity improvement

Mirtec's TAL 3D SCAN not only solves height measurement challenges but also significantly enhances productivity in THT+SMT mixed PCB inspection. Capable of inspecting taller components efficiently, the TAL 3D SCAN facilitates a remarkable 30% increase in productivity, particularly beneficial for PCBs with a high proportion of tall components.

While the official launch of the ART system and TAL 3D SCAN is set for May 2024, Mirtec will preview these innovative products at productronica in Hall A2, Stand 461.