Microtronic to exhibit at the IMAPS EMPC in Germany

Microtronic’s LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets today’s current industry challenges. The system is operated by using solder paste and a temperature profile. A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.

Of course, it also can measure using the common methods with a solder bath or a solder globule. All industry standards including IPC, IES, NF, MIL and JEDEC are supported.

The Akrometrix TherMoiré AXP is a modular metrology solution that utilises the shadow moiré measurement technique, combined with automated phase-stepping, to characterise out-of-plane displacement for samples up to 400x400mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample's behavior during a user-defined thermal profile.

The Sonix ECHO Ultrasonic Flaw Detector is an industry-leading scanning acoustic microscope that provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05µm and spatially resolve defects down to 10µm, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.