Microtronic AG
- Dunnerstrasse 32
CH-4702
Oensingen
Germany - ++ 41 623889 45 45
- http://www.microntronic.ch
- ++ 41 623889 45 55
Microtronic AG Articles
Microtronic & Pemtron sign SEM disti agreement
Microtronic GmbH has announced that it has added the PEMTRON PS Series Scanning Electron Microscopes (SEMs) to its product line up in parts of the EU. The PS Series Models include the PS-210 Compact Desk Top Mini-SEM, the PS-230 High Performance Normal-SEM, and PS-250 Analytical Normal-SEM.
Microtronic installs Sonix ECHO at demo lab in Munich
Microtronic has announced the installation of the latest Sonix ECHO at its demo lab in Munich. The Sonix ECHO is a scanning acoustic microscope that provides a universal inspection tool for packaged semiconductor development, production and failure analysis.
Edge metal squeegees added to product line-up
Microtronic has added Transition Automation’s Permalex Edge Metal Squeegees to its product lineup. Permalex Squeegees are a premium brand of metal squeegees used for SMT and microelectronics printing applications.
Modular metrology solution uses the shadow moiré measurement technique
Microtronic has announced that it has added the Akrometrix TherMoiréAXP to its demo facility in Munich. The AXP has been installed and is available in the Microtronic application lab for demos and test services. The TherMoiré AXP is a modular metrology solution that utilises the shadow moiré measurement technique, combined with automated phase-stepping, to characterise out-of-plane displacement for samples up to 400x400mm.
Microtronic to exhibit at the IMAPS EMPC in Germany
Microtronic has announced plans to exhibit at the 20th European Microelectronics and Packaging Conference & Exhibition (EMPC), scheduled to take place from 14th to 16th September, 2015 in Friedrichshafen, Germany. The company representative will demonstrate the Microtronic LBT-210, Akrometrix TherMoiré AXP and SonixECHO as well as specialty solders from AIM.
Microtronic exhibit at SMT Hybrid Packaging
Microtronic will display a range of products in Booth 7-101L at SMT Hybrid Packaging, scheduled to take place 5th to 7th May, 2015 at the Messe in Nuremberg, Germany. At the booth AIM will highlight specialty soldering materials in alloys of indium, tin, lead, bismuth, cadmium, gold and gallium for a wide range of joining applications.
MICROTRONIC Reports Good Response to New Solderability Tester
MICROTRONIC, a leading sales specialist of microelectronics announces that it has experienced an outstanding volume of enquiries about its LBT210 Solderability Tester which recently made its debut during SMT Nuremberg 2011.